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MIC2870 Datasheet(PDF) 3 Page - Micrel Semiconductor

Part # MIC2870
Description  1.5A Synchronous Boost Flash LED Driver with I2C Interface
PDF  25 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC2870 Datasheet(HTML) 3 Page - Micrel Semiconductor

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Micrel, Inc.
MIC2870
September 5, 2013
3
Revision 1.0
Pin Description (Continued)
Pin Number
Pin Name
Pin Function
7, 15
PGND
Power Ground. PGND is used for the switching NMOS and PMOS of boost converter, and power
ground for LED current sinks.
8
TRSET
Torch-Mode Current Level Programming. Connect a resistor from TRSET to AGND to set the
maximum current in the torch m
ode. For example, a 10kΩ resistor sets the LED sink current to its
maximum value of 187.5mA per channel. TRSET can be grounded if the default maximum torch-
mode current (187.5mA) is desired. TRSET, however, cannot be left floating and the maximum
resistance is limited to 80kΩ.
9
LED2
Channel 2 LED Current Sink. Connect the LED anode to OUT and cathode to LED2.
10
LED1
Channel 1 LED Current Sink. Connect the LED anode to OUT and cathode to LED1.
11
TEN
Torch-Mode Enable. Initiates torch mode when TEN is HIGH. If TEN is left floating, it is pulled-
down internally by a built-in 1µA current source when the device is enabled.
12
OUT
Boost Converter Output.
13
EN
Enable (IC). The MIC2870 is in standby mode when EN is asserted HIGH. If EN is driven low for
more than 1s, the IC is shut down. Alternatively, the I
2C interface can be used for
enabling/disabling the IC through the master control/status register. EN is pulled down by an
internal resistor.
14
SW
Inductor Connection. It is connected to the internal power MOSFETs.
16
SDA
High-Speed Mode (3.4MHz) I²C Data Input/Output.
EP
ePad
Exposed Heat Sink Pad. Connect to PGND ground plane for best thermal performance. This pin
is internally connected to PGND.



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