Micrel, Inc.

MIC24055

December 2012

9

M9999-120712-A

Typical Characteristics (Continued)

Die Temperature* : The temperature measurement was taken at the hottest point on the MIC24055 case mounted on a 5 square inch, 4 layer,

0.62 inch, FR-4 PCB with 2oz finish copper weight per layer, see Thermal Measurement section. Actual results will depend upon the size of the PCB,

ambient temperature and proximity to other heat emitting components.

50

55

60

65

70

75

80

85

90

95

100

0

3

6

9

12

15

OUTPUT CURRENT (A)

Efficiency (VIN = 12V)

vs. Output Current

5.0V

3.3V

2.5V

1.8V

1.5V

1.2V

1.0V

0.9V

0.8V

VIN = 12V

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

0

3

6

9

12

OUTPUT CURRENT (A)

IC Power Dissipation (VIN = 12V)

vs. Output Current

VIN = 12V

V

V

0

20

40

60

80

100

0

2

4

6

8

10

12

OUTPUT CURRENT (A)

Die Temperature* (VIN = 12V)

vs. Output Current

VIN = 12V

V