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SECTION 5:

MECHANICAL AND THERMAL PROPERTIES, LEADED CAPACITORS

5.1 ACCELERATION

10 g (981 m/s)

5.2 VIBRATION SEVERITY

10 to 2000 Hz, 0.75 mm or 98 m/s

2

5.3 SHOCK

Trapezoidal Pulse 10 g (981 m/s) for 6 ms

5.4 TENSILE STRENGTH OF

CONNECTION

10 N for type TAR, 5 N for type TAP/TEP.

5.5 BENDING STRENGTH OF

CONNECTIONS

2 bends at 90°C with 50% of the tensile strength test loading.

5.6 SOLDERING CONDITIONS

Dip soldering permissible provided solder bath temperature

270°C; solder time <3 sec.; circuit board thickness

1.0 mm.

5.7 INSTALLATION INSTRUCTIONS

The upper temperature limit (maximum capacitor surface

temperature) must not be exceeded even under the most

unfavorable conditions when the capacitor is installed. This

must be considered particularly when it is positioned near

components which radiate heat strongly (e.g., valves and

power transistors). Furthermore, care must be taken, when

bending the wires, that the bending forces do not strain the

capacitor housing.

5.8 INSTALLATION POSITION

No restriction.

5.9 SOLDERING INSTRUCTIONS

Fluxes containing acids must not be used.

SECTION 4:

APPLICATION GUIDELINES FOR TANTALUM CAPACITORS

Dangerous Range

Allowable Range

with Preheat

Allowable Range

with Care

270

260

250

240

230

220

210

200

0

2

4

6

8

10

12

Soldering Time (secs.)

Allowable range of peak temp./time combination for wave soldering

Temperature

(oC)

*See appropriate product specification

TAP/TEP Technical Summary and

Application Guidelines

4.1 SOLDERING CONDITIONS AND

BOARD ATTACHMENT

The soldering temperature and time should be the minimum

for a good connection.

A suitable combination for wavesoldering is 230°C - 250°C

for 3 - 5 seconds.

Small parametric shifts may be noted immediately after wave

solder, components should be allowed to stabilize at room

temperature prior to electrical testing.

AVX leaded tantalum capacitors are designed for wave

soldering operations.

4.2 RECOMMENDED SOLDERING

PROFILES

Recommended wave soldering profile for mounting of

tantalum capacitors is shown below.

After soldering the assembly should preferably be allowed to

cool naturally. In the event that assisted cooling is used, the

rate of change in temperature should not exceed that used

in reflow.