 2010 Microchip Technology Inc.

DS22008E-page 5

MCP1702

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Operating Junction Temperature Range

-40

+125

°C

Steady State

Maximum Junction Temperature

—

+150

°C

Transient

Storage Temperature Range

-65

+150

°C

Thermal Package Resistance (Note 2)

Thermal Resistance, 3L-SOT-23A



JA

—

336

—

°C/W

EIA/JEDEC JESD51-7

FR-4 0.063 4-Layer Board



JC

—110

—

°C/W

Thermal Resistance, 3L-SOT-89



JA

—

153.3

—

°C/W

EIA/JEDEC JESD51-7

FR-4 0.063 4-Layer Board



JC

—

100

—

°C/W

Thermal Resistance, 3L-TO-92



JA

—

131.9

—

°C/W



JC

—

66.3

—

°C/W

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained

junction temperatures above 150°C can impact the device reliability.

2:

Thermal Resistance values are subject to change. Please visit the Microchip web site for the latest packaging

information.