JC030D-M datasheet(16/20 Pages) GE

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JC030-Series Power Modules:

Data Sheet

18 Vdc to 36 Vdc Inputs; 2 Vdc to 15 Vdc Outputs;13 W to 30 W

March 26, 2008

Lineage Power

Thermal Considerations (continued)

Heat Sink Selection (continued)

8-1052(C).a

Figure 32. Case-to-Ambient Thermal Resistance

vs. Air Velocity Curves; Either

Orientation

Although the previous example uses 100 °C as the

maximum case temperature, for extremely high-reliabil-

ity applications, one can use a lower temperature for

TC, max.

The thermal resistances shown in Figure 32 are for

heat transfer from the sides and bottom of the module

as well as the top side with the attached heat sink;

therefore, the case-to-ambient thermal resistances

shown will generally be lower than the resistance of the

heat sink by itself. The data in Figure 32 was taken with

a thermally conductive dry pad between the case and

the heat sink to minimize contact resistance (typically

0.1 °C/W to 0.3 °C/W).

For a more detailed explanation of thermal energy

management for this series of power modules as well

as more details on available heat sinks, please request

the following technical note: Thermal Management JC-

and JW-Series 30 W Board-Mounted Power Modules

(TN97-016EPS).

Layout Considerations

Copper paths must not be routed beneath the power

module standoffs.

0.25

(50)

0.51

(100)

0.76

(150)

1.02

(200)

1.78

(350)

2.03

(400)

AIR VELOCITY, ms-1 (ft./min.)

1.27

(250)

1.52

(300)

NO HEAT SINK

1/4 in. HEAT SINK

1/2 in. HEAT SINK

1 in. HEAT SINK

1 1/2 in. HEAT SINK

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