4

Tyco Electronics Corp.

Technical Note

July 1996

250 W—300 W Board-Mounted Power Modules

Thermal Management for FC- and FW-Series

Heat Sink Configuration

Several standard heat sinks are available for the FC- and FW-Series 250 W—300 W BMPMs, as shown in Figures

6 and 7. The heat sinks mount to the top surface of the module with M3 x 0.5 screws torqued to 5 in.-lb. (0.56 N-m).

Placing a thermally conductive dry pad or thermal grease between the case and the heat sink minimizes contact

resistance (typically 0.1 °C/W to 0.3 °C/W) and temperature drop. All heat sink curve data taken had such a dry

pad present.

8-1316

Figure 6. Heat Sinks with Longitudinal Fins

1/4 IN. (MHSL02555)

1/2 IN. (MHSL05055)

1 IN. (MHSL10055)

1 1/2 IN. (MHSL15055)

4.56

2.36