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MBB0207 Datasheet(PDF) 11 Page - Vishay Siliconix

Part # MBB0207
Description  Professional Thin Film Leaded Resistors
PDF  13 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

MBB0207 Datasheet(HTML) 11 Page - Vishay Siliconix

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www.vishay.com
For technical questions, contact: filmresistorsleaded@vishay.com
Document Number: 28766
32
Revision: 03-Dec-12
MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Professional
Vishay Beyschlag
Professional Thin Film Leaded Resistors
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT\rARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1) ± (0.4 %
R + 0.05
) for MBE/SMA 0414
(2) ± (0.8 %
R + 0.05
) for MBE/SMA 0414
(3) ± (0.2 %
R + 0.05
) for MBE/SMA 0414
(4) ± (0.4 %
R + 0.05
) for MBE/SMA 0414
4.23
Climatic
sequence:
4.23.2
2 (Ba)
Dry heat
155 °C; 16 h
4.23.3
30 (Db)
Damp heat,
cyclic
55 °C; 24 h;
90 % to 100 % RH;
1 cycle
4.23.4
1 (Aa)
Cold
- 55 °C; 2 h
4.23.5
13 (M)
Low air
pressure
8.5kPa; 2h;
15 °C to 35 °C
4.23.6
30 (Db)
Damp heat,
cyclic
55 °C; 5 days;
95 % to 100 % RH;
5 cycles
± (0.5 %
R + 0.05
)
no visible
damage
± (1 %
R + 0.05
)
no visible
damage
± 2 %
R
no visible
damage
4.13
-
Short time
overload
Room temperature;
U = 2.5 x
or
U = 2 x Umax.; 5 s
± (0.1 %
R + 0.01
)
no visible
damage
± (0.25 %
R + 0.05
)
no visible
damage
± 0.5 %
R
no visible
damage
4.19
14 (Na)
Rapid change
of temperature
30 min at LCT = - 55 °C
30 min at UCT= 155 °C
5 cycles
± (0.1 %
R + 0.01
)
± (0.25 %
R + 0.05
)
± 0.5 %
R
MBA/SMA 0204:
500 cycles
MBB/SMA 0207:
200 cycles
MBE/SMA 0414:
100 cycles
± (0.5 %
R + 0.05
)
± (0.5 %
R + 0.05
)
± (0.5 %
R + 0.05
)
4.29
45 (XA)
Component
solvent
resistance
Isopropyl alcohol
+ 23 °C; toothbrush
method
Marking legible;
no visible damage
4.18.2
20 (Tb)
Resistance to
soldering heat
Unmounted
components;
(260 ± 3) °C;
(10 ± 1) s
± (0.1 %
R + 0.01
)
no visible
damage
± (0.25 %
R + 0.05
)
no visible
damage
± 0.5 %
R
no visible
damage
4.17
20 (Ta)
Solderability
+ 235 °C; 2 s
solder bath method;
SnPb40
Good tinning (> 95 % covered, no visible damage)
+ 245 °C; 3 s
solder bath method;
SnAg3Cu0.5
4.22
6 (B4)
Vibration
6 h; 10 Hz to 2000 Hz
1.5 mm or 196 m/s2
± (0.1 %
R + 0.01
)
± (0.25 %
R + 0.05
)
± 0.5 %
R
4.16
21 (Ua1)
21 (Ub)
21 (Uc)
Robustness of
terminations
Tensile, bending and
torsion
± (0.1 %
R + 0.01
)
± (0.25 %
R + 0.05
)
± 0.5 %
R
4.7
-
Voltage proof
URMS = Uins; 60 s
No flashover or breakdown
4.40
-
Electrostatic
discharge
(human body
model)
IEC 61340-3-1;
3 pos. + 3 neg.
MBA/SMA 0204: 2 kV
MBB/SMA 0207: 4 kV
MBE/SMA 0414: 6 kV
± (0.5 %
R +0.05
)
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2-
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (
R max.)
Stability for product
types:
STABILITY
CLASS 0.5
STABILITY
CLASS 1
STABILITY
CLASS 2
MBA/SMA 0204
1
 to 332 k
0.22
 to < 1 
> 332 k
MBB/SMA 0207
1
 to 1 M
0.22
 to < 1 
> 1 M
MBE/SMA 0414
1
 to 2.4 M
0.22
 to < 1 
> 2.4 M
P
70 x R



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