NOTES: UNLESS OTHERWISE SPECIFIED

1. EPOXY COATING

2. 63Sn/37Pb EUTECTIC BUMP

3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.

4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTER

CLOCKWISE.

5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS

PACKAGE HEIGHT.

6.NO JEDEC REGISTRATION AS OF AUG.1999.

micro SMD, 5 Bump, Package (TPA05 - 170 µm ball)

NS Package Number TPA05

For Order Numbers, refer to Table 1 “Ordering Information” section of this document.

The dimensions for X1, X2 and X3 are as given:

X1 = 0.930 +/− 0.030mm

X2 = 1.107 +/− 0.030mm

X3 = 0.500 +/− 0.075mm

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