STF18N55M5 datasheet(3/22 Pages) STMICROELECTRONICS

3 / 22 page

STB18N55M5, STD18N55M5, STF18N55M5, STP18N55M5

Electrical ratings

Doc ID 17078 Rev 2

3/22

Electrical ratings

Table 2.

Absolute maximum ratings

Symbol

Parameter

Value

Unit

TO-220, DPAK,

D²PAK

TO-220FP

VGS

Gate-source voltage

Drain current (continuous) at TC = 25 °C

13 (1)

Limited only by maximum temperature allowed.

Drain current (continuous) at TC = 100 °C

8.3

8.3 (1)

IDM

(2)

Pulse width limited by safe operating area.

Drain current (pulsed)

52 (1)

PTOT

Total dissipation at TC = 25 °C

IAR

Avalanche current, repetitive or not-

repetitive (pulse width limited by Tj max)

EAS

Single pulse avalanche energy

(starting Tj = 25°C, ID = IAR, VDD = 50 V)

200

dv/dt (3)

ISD ≤13 A, di/dt ≤400 A/µs, VPeak < V(BR)DSS, VDD = 400 V.

Peak diode recovery voltage slope

V/ns

VISO

Insulation withstand voltage (RMS) from all

three leads to external heat sink

(t = 1 s; TC = 25 °C)

2500

Tstg

Storage temperature

- 55 to 50

°C

Max. operating junction temperature

150

°C

Table 3.

Thermal data

Symbol

Parameter

Value

Unit

DPAK D²PAK TO-220

TO-220FP

Rthj-case Thermal resistance junction-case max

1.39

°C/W

Rthj-amb Thermal resistance junction-ambient max

62.5

°C/W

Rthj-pcb

Thermal resistance junction-pcb max

°C/W

Maximum lead temperature for soldering

purpose

300

°C

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