HF397 datasheet(5/6 Pages) MACOM

5 / 6 page

06-2013, Rev. 0613

www.te.com

a TE Connectivity Ltd. company

Datasheets and product specification

according to IEC 61810-1 and to be used

only together with the ‘Definitions’ section.

Datasheets and product data is subject to the

terms of the disclaimer and all chapters of

the ‘Definitions’ section, available at

http://relays.te.com/definitions

Datasheets, product data, ‘Definitions’ sec-

tion, application notes and all specifications

are subject to change.

AXICOM

RF Signal Relays

HF3 Relay (Continued)

Processing

full line: typical

dotted line: process limits

external preheating

240°C

180°C

130°C

100°C

forced cooling

20 to 40s

Time [s]

Vapour phase soldering

temperature/time proﬁle

(lead and housing peak temp.)

Recommended soldering conditions

Vapour phase soldering

Time [s]

Recommended reﬂow soldering proﬁle

Infrared soldering

temperature/time proﬁle

(lead and housing peak temp.)

Time [s]

Resistance to soldering heat

Infrared soldering

temperature/time proﬁle

(lead and housing peak temp.)

Packing

Tape and reel for SMT

Reel dimensions

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