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AM3703 Datasheet(PDF) 275 Page - Texas Instruments |
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AM3703 Datasheet(HTML) 275 Page - Texas Instruments |
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275 / 280 page  PACKAGE OPTION ADDENDUM www.ti.com 2-Aug-2013 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples AM3715CBPA ACTIVE POP-FCBGA CBP 515 168 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 105 AM3715CBPA AM3715CBPD100 ACTIVE POP-FCBGA CBP 515 168 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 90 AM3715CBPD100 AM3715CBPD100-AS3 AM3715CUS ACTIVE FCBGA CUS 423 90 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 AM3715CUS AM3715CUS100 ACTIVE FCBGA CUS 423 90 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 AM3715CUS100 AM3715CUSA ACTIVE FCBGA CUS 423 90 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 105 AM3715CUSA AM3715CUSD100 ACTIVE FCBGA CUS 423 90 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 90 AM3715CUSD100 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. |
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