BF514F datasheet(63/68 Pages) AD

63 / 68 page

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B

Page 63 of 68

January 2011

OUTLINE DIMENSIONS

Dimensions in Figure 72 are shown in millimeters.

Figure 72. 176-Lead Low Profile Quad Flat Package [LQFP_EP]

(SQ-176-2)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MS-026-BGA-HD

1.45

1.40

1.35

0.15

0.10

0.05

TOP VIEW

(PINS DOWN)

133

132

176

0.27

0.22

0.17

0.50

BSC

LEAD PITCH

1.60

MAX

26.20

26.00 SQ

25.80

24.10

24.00 SQ

23.90

VIEW A

PIN 1

0.08 MAX

COPLANARITY

VIEW A

ROTATED 90° CCW

SEATING

PLANE

12°

7°

0°

0.20

0.15

0.09

0.75

0.60

0.45

1.00 REF

BOTTOM VIEW

(PINS UP)

133

132

176

EXPOSED

PAD

EXPOSED PAD IS CENTERED ON

THE PACKAGE.

5.80 REF

NOTE: THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND

THERMALLY CONNECTED TO GND. IMPLEMENT THIS BY

SOLDERING THE EXPOSED PAD TO A GND PCB LAND THAT IS

THE SAME SIZE AS THE EXPOSED PAD. THE GND PCB LAND

SHOULD BE ROBUSTLY CONNECTED TO THE GND PLANE IN

THE PCB WITH AN ARRAY OF THERMAL VIAS FOR BEST

PERFORMANCE.

BF514F Datasheet(PDF) 63 Page - Analog Devices

BF514F Datasheet(HTML) 63 Page - Analog Devices

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