Pressure Sensors

140PC Series

Absolute, Differential, Gage, Vacuum Gage/Amplified

Honeywell Sensing and Control 1-800-537-6945 USA

1-815-235-6847 International 1-800-737-3360 Canada

37

FEATURES

PCB terminals on opposite side from

the ports

Fully signal conditioned

140PC SERIES PERFORMANCE CHARACTERISTICS at 8.0 ±0.01 VDC

Excitation, 25°C

Min.

Typ.

Max.

Units

Excitation

7.00

8.00

16.0

VDC

Supply Current

---

8.00

20.0

mA

Current Sourcing Output

---

---

10

mA

Null Offset (141/142PC)

0.95

1.00

1.05

V

Null Offset (143PC)*

3.45

3.50

3.55

V

Null Offset

142PC15A @ 2 psia

1.62

1.67

1.72

V

142PC30A @ 2 psia

1.28

1.33

1.38

V

Output at Full Pressure

5.90

6.00

6.10

V

Span† (141/142PC)

4.95

5.00

5.05

V

Span† (143PC)*

---

5.00

---

V

Span

142PC15A (2 to 15 psia)

4.28

4.33

4.48

V

142PC30A (2 to 30 psia)

4.62

4.67

4.72

V

Ratiometricity Error

7 to 8 V or 8 to 9 V

---

±0.50

---

%Span

9 to 12 V

---

±2.00

---

Stability over One Year

---

±0.50

---

%Span

Response Time

---

---

1.00

msec

Common Mode Pressure**

---

---

40

psi

Weight

---

28

---

grams

Short Circuit Protection

Output may be shorted indefinitely to ground

Output Ripple

None, DC device

Ground Reference

Supply and output are common

*Positive and negative pressure measurement.

**Higher common mode pressures possible if sensor is not used over entire operating temperature range.

†Span is defined as the algebraic difference between end points. Please note: actual output is 1 V to 6 V (at 8.00

±0.01 VDC). Span is then 5V.

ENVIRONMENTAL SPECIFICATIONS

Operating Temperature

−40° to +85°C (−40° to +185°F)

Storage Temperature

−55° to +125°C (−67° to +257°F)

Compensated Temperature

−18° to +63°C (0° to +145°F)

Shock

MIL-STD-202, Method 213 (50 g, half sine, 6 msec)

Vibration

MIL-STD-202, Method 204 (10 to 2000 Hz at 10 g)

Media

P2 port Wetted materials; polyester housing, epoxy

adhesive, silicon, borosilicate glass, and silicon-to-

glass bond*

P1 port Dry gases only

*Liquid media containing some highly ionic solutions could potentially neutralize the chip-to-glass tube

bond.