CBC910

©2012 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com

DS-72-11 Rev 5

Page 14 of 14

Preliminary

CBC910 Die Pad Locations

VDD

VBAT

ENABLE

VMODE

GND

VOUT

RESET/

CP

CN

Trim4

51.35

707.3

Disclaimer of Warranties; As Is

The information provided in this data sheet is provided “As Is” and Cymbet Corporation disclaims all representations or warranties of any

kind, express or implied, relating to this data sheet and the Cymbet battery product described herein, including without limitation, the

implied warranties of merchantability, fitness for a particular purpose, non-infringement, title, or any warranties arising out of course of

dealing, course of performance, or usage of trade. Cymbet battery products are not approved for use in life critical applications. Users shall

confirm suitability of the Cymbet battery product in any products or applications in which the Cymbet battery product is adopted for use and

are solely responsible for all legal, regulatory, and safety-related requirements concerning their products and applications and any use of

the Cymbet battery product described herein in any such product or applications.

Cymbet, the Cymbet Logo, and EnerChip are Cymbet Corporation Trademarks

Ordering Information

EnerChip CC Part Number

Description

Notes

CBC910-BDC-WP

CBC910 Bare Die

Shipped in Waffle Pack

CBC910-BUC-WP

CBC910 Bare Die Solder Bumped

Shipped in Waffle Pack

CBC910-WAF

CBC910 Bare Die

Shipped as Wafer

CBC910-D3C

CBC910 DFN Package

3mm x 3mm 8L DFN Package

Notes:

1) All dimensions measured to the center of the respective bond pad and measured relative to the lower left

corner of metal-2 on the Trim4 pad as shown below. That Trim4 coordinate is the 0,0 reference point for the data

extents of the die. Total die size is 150um larger in x and y as defined by the street width.

2) Die size to center of scribe is 960um (x) by 1360um (y).

3) Drawing not to scale. All dimensions in microns.