PIC16C620 datasheet(91/128 Pages) MICROCHIP

91 / 128 page

 2003 Microchip Technology Inc.

DS30235J-page 89

PIC16C62X

12.1

DC Characteristics: PIC16C62X-04 (Commercial, Industrial, Extended)

PIC16C62X-20 (Commercial, Industrial, Extended)

PIC16LC62X-04 (Commercial, Industrial, Extended) (CONT.)

PIC16C62X

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40

°C ≤ TA ≤ +85°C for industrial and

°C ≤ TA ≤ +70°C for commercial and

-40

°C ≤ TA ≤ +125°C for extended

PIC16LC62X

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40

°C ≤ TA ≤ +85°C for industrial and

°C ≤ TA ≤ +70°C for commercial and

-40

°C ≤ TA ≤ +125°C for extended

Operating voltage V

DD range is the PIC16C62X range.

Param

. No.

Sym

Characteristic

Min

Typ† Max

Units

Conditions

D022

D022A

D023

D023A

∆IWDT

∆IBOR

∆ICOM

∆IVREF

WDT Current(5)

Brown-out Reset Current(5)

Comparator Current for each

Comparator(5)

REF Current(5)

—

6.0

350

—

425

100

300

µA

DD=4.0V

(125

°C)

BOD enabled, V

DD = 5.0V

DD = 4.0V

D022

D022A

D023

D023A

∆IWDT

∆IBOR

∆ICOM

∆IVREF

WDT Current(5)

Brown-out Reset Current(5)

Comparator Current for each

Comparator(5)

REF Current(5)

—

6.0

350

—

425

100

300

µA

DD=3.0V

BOD enabled, V

DD = 5.0V

DD = 3.0V

OSC

LP Oscillator Operating Frequency

RC Oscillator Operating Frequency

XT Oscillator Operating Frequency

HS Oscillator Operating Frequency

—

200

kHz

MHz

All temperatures

OSC

LP Oscillator Operating Frequency

RC Oscillator Operating Frequency

XT Oscillator Operating Frequency

HS Oscillator Operating Frequency

—

200

kHz

MHz

All temperatures

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

Note 1: This is the limit to which V

DD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and

switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current

consumption.

The test conditions for all I

DD measurements in Active Operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V

DD,

MCLR = V

DD; WDT enabled/disabled as specified.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with

the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V

DD or VSS.

4: For RC osc configuration, current through R

EXT is not included. The current through the resistor can be estimated by the

formula: Ir = V

DD/2REXT (mA) with REXT in k

Ω.

5: The

∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the

base I

DD or IPD measurement.

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