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PCM1725DR Datasheet(PDF) 3 Page - Texas Instruments |
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PCM1725DR Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 14 page ![]() ® 3 PCM1725 PIN ASSIGNMENTS PIN NAME I/O FUNCTION 1(1) LRCIN IN Sample Rate Clock Input 2(1) DIN IN Audio Data Input 3(1) BCKIN IN Bit Clock Input for Audio Data. 4 NC — No Connection 5 CAP — Common Pin of Analog Output Amp 6VOUTR OUT Right-Channel Analog Output 7 GND — Ground 8VCC — Power Supply 9VOUTL OUT Left-Channel Analog Output 10 NC — No Connection 11 NC — No Connection 12(2) DM IN De-emphasis Control HIGH: De-emphasis ON LOW: De-emphasis OFF 13(2) FORMAT — Audio Data Format Select HIGH: I2S Data Format LOW: Standard Data Format 14 SCKI IN System Clock Input (256fS or 384fS) NOTES: (1) Schmitt Trigger input. (2) Schmitt Trigger input with internal pull-up. PIN CONFIGURATION TOP VIEW SOIC LRCIN DIN BCKIN NC CAP V OUTR GND SCKI FORMAT DM NC NC V OUTL V CC 1 2 3 4 5 6 7 14 13 12 11 10 9 8 PCM1725 PACKAGE INFORMATION PACKAGE DRAWING PRODUCT PACKAGE NUMBER(1) PCM1725U 14 Pin SOIC 235 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. ABSOLUTE MAXIMUM RATINGS Power Supply Voltage ....................................................................... +6.5V +VCC to +VDD Difference ................................................................... ±0.1V Input Logic Voltage .................................................. –0.3V to (VDD + 0.3V) Power Dissipation .......................................................................... 290mW Operating Temperature Range ......................................... –25 °C to +85°C Storage Temperature ...................................................... –55 °C to +125°C Lead Temperature (soldering, 5s) .................................................. +260 °C Thermal Resistance, θ JA .............................................................. +90°C/W ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Not Recommended For New Designs |
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