TPS62082

1

10µF

3.6V .. 6V

V

IN

22µF

180k

V

OUT

POWER GOOD

3.3V

SW

VOS

VIN

EN

GND

MODE

PG

FB

L

C

IN

C

OUT

R

2

R

1

V

IN

V

OUT

GND

1

TPS62080, TPS62080A

TPS62081, TPS62082

www.ti.com

SLVSAE8D – SEPTEMBER 2011 – REVISED JULY 2013

Figure 32. PCB Layout Suggestion

THERMAL INFORMATION

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-

dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

•

Improving the power dissipation capability of the PCB design

•

Improving the thermal coupling of the component to the PCB by soldering the ThermalPAD™

•

Introducing airflow in the system

For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics

Application Notes SZZA017 and SPRA953.

APPLICATION EXAMPLES

Figure 33. 3.3V Fixed Output Voltage Application (TPS62082)

Copyright © 2011–2013, Texas Instruments Incorporated

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Product Folder Links: TPS62080 TPS62080A TPS62081 TPS62082