TLE2037IP datasheet(3/46 Pages) TI1

Part #	TLE2037IP

Description	EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS

PDF	46 Pages

Scroll/Zoom	100%

Manufacturer	TI1 [Texas Instruments]

Direct Link	http://www.ti.com

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TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y

EXCALIBUR LOW-NOISE HIGH-SPEED

PRECISION OPERATIONAL AMPLIFIERS

SLOS192C − FEBRUARY 1997 − REVISED APRIL 2010

TLE202xY chip information

This chip, when properly assembled, displays characteristics similar to the TLE202xC. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4 × 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE ±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(1)

(2)

(3)

(4)

(6)

(7)

(8)

−

OUT

IN +

IN −

VCC+

VCC−

OFFSET N1

OFFSET N2

(1)

(3)

(2)

(8)

(7)

(4)

(6)

TLE2037IP Datasheet(PDF) 3 Page - Texas Instruments

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