LTC6400-14

15

640014fb

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

3.00

± 0.10

(4 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.45

± 0.05

(4 SIDES)

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.45

± 0.10

(4-SIDES)

0.75

± 0.05

R = 0.115

TYP

0.25

± 0.05

1

PIN 1 NOTCH R = 0.20 TYP

OR 0.25

× 45° CHAMFER

15

16

2

0.50 BSC

0.200 REF

2.10

± 0.05

3.50

± 0.05

0.70

±0.05

0.00 – 0.05

(UD16) QFN 0904

0.25

±0.05

0.50 BSC

PACKAGE

OUTLINE

UD Package

16-Lead Plastic QFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1691)

TYPICAL APPLICATIONS

Test Circuit B, 4-Port Analysis

0.1μF

13

640014 TA02

1

2

14

7

15

+OUT

+OUTF

–OUTF

–OUT

+IN

IN+

OUT–

IN–

OUT+

+IN

–IN

–IN

5

16

100Ω

12.5Ω

500Ω

100Ω

500Ω

6

4

V–

3

12

V–

11

ENABLE

9

V–

10

COMMON

MODE CONTROL

1/2

AGILENT

E5O71A

BIAS CONTROL

8

12.5Ω

37.4Ω

37.4Ω

50Ω

50Ω

2.7pF

1000pF

0.1μF

0.1μF

0.1μF

PORT 3

(50Ω)

PORT 4

(50Ω)

1/2

AGILENT

E5O71A

200Ω

0.1μF

0.1μF

PORT 1

(50Ω)

PORT 2

(50Ω)

0.1μF

1000pF

LTC6400-14