Copyright

© ANPEC Electronics Corp.

Rev. A.8 - Dec., 2008

APL1086

www.anpec.com.tw

14

t 25 C to Peak

tp

Ramp-up

t

L

Ramp-down

ts

Preheat

Tsmax

Tsm in

T

L

T

P

25

Time

Critical Zone

T

°

Test item

Method

Description

SOLDERABILITY

MIL-STD-883D-2003

245

°C, 5 sec

HOLT

MIL-STD-883D-1005.7

1000 Hrs Bias @125

°C

PCT

JESD-22-B,A102

168 Hrs, 100

%RH, 121°C

TST

MIL-STD-883D-1011.9

-65

°C~150°C, 200 Cycles

ESD

MIL-STD-883D-3015.7

VHBM > 2KV, VMM > 200V

Latch-Up

JESD 78

Reliability Test Program

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate

3

°C/second max.

3

°C/second max.

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (min to max) (ts)

100

°C

150

°C

60-120 seconds

150

°C

200

°C

60-180 seconds

Time maintained above:

183

°C

60-150 seconds

217

°C

60-150 seconds

Peak/Classification Temperature (Tp)

See table 1

See table 2

Time within 5

°C of actual

Peak Temperature (tp)

10-30 seconds

20-40 seconds

Ramp-down Rate

6

°C/second max.

6

°C/second max.

Time 25

°C to Peak Temperature

6 minutes max.

8 minutes max.

Notes: All temperatures refer to topside of the package. Measured on the body surface.

Classification Reflow Profiles