Copyright

© ANPEC Electronics Corp.

Rev. A.4 - Dec., 2012

APW8804

www.anpec.com.tw

2

Ordering and Marking Information

Pin Configuration

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Symbol

Parameter

Rating

Unit

Input Supply Voltage

-0.3 ~ 6.5

V

<30ns pulse width

V

LX to GND Voltage

>30ns pulse width

V

POK, FB, EN to GND Voltage

-0.3 ~ 6.5

V

Power Dissipation

2

W

Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

NC 1

LX 3

10 PVDD

LX 2

EN 5

9 PVDD

7 NC

8 VDD

TDFN 3X3-10

(Top View)

11

GND

POK 4

6 FB

APW8804

Exposed pad

11

GND

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

LX 1

LX 2

POK 3

5 FB

EN 4

6 GND

7 VDD

8 PVDD

APW8804

SOP-8P

(Top View)

9

GND

9

GND

Exposed pad

The pin 6 must be connected to the pin 9 (exposed pad)

APW8804

Handling Code

Temperature Range

Package Code

APW8804

XXXXX

Package Code

KA : SOP-8P

QB : TDFN3x3-10

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

APW

8804

XXXXX

APW8804 KA :

APW8804 QB :

XXXXX - Date Code

Assembly Material

XXXXX - Date Code