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MP2303ADP Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP2303ADP Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 15 page ![]() MP2303A – 3A, 28V, 360kHz SYNCHRONOUS RECTIFIED, STEP-DOWN CONVERTER MP2303A Rev.1.1 www.MonolithicPower.com 2 7/25/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking Free Air Temperature (TA) MP2303ADN* SOIC8E M2303ADN -40 C to +85C MP2303ADP** PDIP8 MP2303A -40 C to +85C * For Tape & Reel, add suffix –Z (e.g. MP2303ADN–Z); For RoHS compliant packaging, add suffix –LF (e.g. MP2303ADN–LF–Z) ** For Tape & Reel, add suffix –Z (e.g. MP2303ADP–Z); For RoHS compliant packaging, add suffix –LF (e.g. MP2303ADP–LF–Z) PACKAGE REFERENCE BS IN SW GND SS EN COMP FB 1 2 3 4 8 7 6 5 TOP VIEW 8 7 6 5 SS EN COMP FB BS IN SW GND 1 2 3 4 TOP VIEW MP2303A_PD01-PDIP8 ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VIN ........................-0.3V to +30V Switch Voltage VSW ..................-1V to VIN + 0.3V Boost Voltage VBS .......... VSW - 0.3V to VSW + 6V All Other Pins..................................-0.3V to +6V Junction Temperature...............................150°C Continuous Power Dissipation (TA = +25°C)(2) SOIC8E...................................................... 2.5W PDIP8 ........................................................ 1.2W Lead Temperature ....................................260°C Storage Temperature .............. -65°C to +150°C Recommended Operating Conditions (3) Input Voltage VIN ..............................4.7V to 28V Output Voltage VOUT.......................0.80V to 25V Maximum Junction Temp. (TJ) ................+125°C Thermal Resistance (4) θJA θJC SOIC8E .................................. 50 ...... 10... C/W PDIP8 .................................... 105 ..... 45... C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB.. |
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