MTP55N06Z

2

Motorola TMOS Power MOSFET Transistor Device Data

Characteristic

Symbol

Min

Typ

Max

Unit

OFF CHARACTERISTICS

Drain–to–Source Breakdown Voltage

(Cpk

≥ 2.0)

(VGS = 0 Vdc, ID = 250 µAdc)

Temperature Coefficient (Positive)

V(BR)DSS

60

—

—

53

—

—

Vdc

mV/

°C

Zero Gate Voltage Drain Current

(VDS = 60 Vdc, VGS = 0 Vdc)

(VDS = 60 Vdc, VGS = 0 Vdc, TJ = 125°C)

IDSS

—

—

—

—

1.0

10

µAdc

Gate–Body Leakage Current (VGS = ± 20 Vdc, VDS = 0 Vdc)

IGSS

—

—

100

nAdc

ON CHARACTERISTICS (1)

Gate Threshold Voltage

(Cpk

≥ 2.0)

(VDS = VGS, ID = 250 µAdc)

Threshold Temperature Coefficient (Negative)

VGS(th)

2.0

—

3.0

6.0

4.0

—

Vdc

mV/

°C

Static Drain–to–Source On–Resistance

(Cpk

≥ 2.0)

(VGS = 10 Vdc, ID = 27.5 Adc)

RDS(on)

—

14

16

m

Ω

Drain–to–Source On–Voltage (VGS = 10 Vdc)

(ID = 55 Adc)

(ID = 27.5 Adc, TJ = 125°C)

VDS(on)

—

—

0.825

0.74

1.2

1.0

Vdc

Forward Transconductance (VDS = 4.0 Vdc, ID = 27.5 Adc)

gFS

12

15

—

Mhos

DYNAMIC CHARACTERISTICS

Input Capacitance

(V

25 Vdc V

0 Vdc

Ciss

—

1390

1950

pF

Output Capacitance

(VDS = 25 Vdc, VGS = 0 Vdc,

f = 1.0 MHz)

Coss

—

520

730

Transfer Capacitance

f = 1.0 MHz)

Crss

—

119

238

SWITCHING CHARACTERISTICS (2)

Turn–On Delay Time

(V

30 Vd

I

55 Ad

td(on)

—

27

54

ns

Rise Time

(VDD = 30 Vdc, ID = 55 Adc,

VGS(on) =10Vdc

tr

—

157

314

Turn–Off Delay Time

VGS(on) = 10 Vdc,

RG = 9.1 Ω)

td(off)

—

116

232

Fall Time

G

)

tf

—

126

252

Gate Charge

(See Figure 8)

(V

48 Vd

I

55 Ad

QT

—

40

56

nC

(See Figure 8)

(VDS = 48 Vdc, ID = 55 Adc,

Q1

—

7.0

—

( DS

, D

,

VGS = 10 Vdc)

Q2

—

18

—

Q3

—

15

—

SOURCE–DRAIN DIODE CHARACTERISTICS

Forward On–Voltage

(IS = 55 Adc, VGS = 0 Vdc)

(IS = 55 Adc, VGS = 0 Vdc, TJ = 125°C)

VSD

—

—

0.93

0.82

1.1

—

Vdc

Reverse Recovery Time

(I

55 Ad

V

0 Vd

trr

—

57

—

ns

(IS = 55 Adc, VGS = 0 Vdc,

ta

—

32

—

( S

,

GS

,

dIS/dt = 100 A/µs)

tb

—

25

—

Reverse Recovery Stored Charge

QRR

—

0.11

—

µC

INTERNAL PACKAGE INDUCTANCE

Internal Drain Inductance

(Measured from contact screw on tab to center of die)

(Measured from drain lead 0.25

″ from package to center of die)

LD

—

—

3.5

4.5

—

—

nH

Internal Source Inductance

(Measured from the source lead 0.25

″ from package to source bond pad)

LS

—

7.5

—

(1) Pulse Test: Pulse Width

≤ 300 µs, Duty Cycle ≤ 2%.

(2) Switching characteristics are independent of operating junction temperature.