MP2671 – CHARGE SYSTEM PROTECTION CIRCUIT

MP2671 Rev. 0.9

www.MonolithicPower.com

2

2/23/2009

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© 2009 MPS. All Rights Reserved.

PACKAGE REFERENCE

TOP VIEW

VIN

VIN

GND

WRN

N/C

N/C

1

2

3

4

5

6

N/C

OUT

OUT

ILIM

VB

EN

12

11

10

9

8

7

EXPOSED PAD

(CONNECT TO GND)

Part Number*

Package

MP2671DL

QFN12

(3mm x 4mm)

Temperature

Top Marking

–40

°C to +85°C

2671

For RoHS compliant packaging, add suffix –LF

(e.g. MP2671DL–LF–Z)

OUT and VB to GND ....................... –0.3V to 7V

Junction Temperature...............................150

°C

Lead Temperature (Solder) ........................ 260

°

Storage Temperature ..............–65

°C to +150°C

Recommended Operating Conditions

(2)

Operating Current Range………….. 0A to 1.5A

Operating Temperature .............–40

°C to +85°C

Thermal Resistance

(3)

QFN12 (3mm x 4mm)............. 48 ...... 10...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The device is not guaranteed to function outside of its

operating conditions.

3) Measured on JESD51-7 4 layers board.

ELECTRICAL CHARACTERISTICS

Parameter

Symbol

Condition

Min

Typ

Max

Units

Power-On Reset

Rising VIN Threshold

2.4

2.58

2.7

V

POR Hysteresis

110

mV

When enabled

0.6

mA

VIN Bias Current

When disabled

25

µA

Protection

Input Over-voltage Protection

(OVP)

5.65

5.85

6.0

V

Input OVP Hysteresis

50

mV

Input OVP Falling Threshold

5.55

V

Input OVP Propagation Delay

1

µs

Over-current Protection

0.93

1.0

1.07

A

Overcurrent Protection Blanking

Time

170

µs

Battery Over-voltage Protection

Threshold

4.28

4.34

4.4

V

Battery OVP Threshold

Hysteresis

30

mV

Battery OVP Falling Threshold

4.225

V

Battery OVP Blanking Time

180

µs