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MP4350 Datasheet(PDF) 12 Page - Monolithic Power Systems |
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MP4350 Datasheet(HTML) 12 Page - Monolithic Power Systems |
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12 / 14 page ![]() MP4350 – 2.5A, 4MHz, 20V STEP-DOWN CONVERTER MP4350 Rev. 1.0 www.MonolithicPower.com 12 5/26/2008 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2008 MPS. All Rights Reserved. Recommended VIN (max) vs Switching Frequency 30 25 20 15 10 5 1500 2000 2500 3000 3500 4000 VOUT=3.3V fs (KHz) VOUT=2.5V Figure 2—Recommend Max VIN vs. fs Since the internal bootstrap circuitry has higher impedance, which may not be adequate to charge the bootstrap capacitor during each (1-D)×Ts charging period, an external bootstrap charging diode is strongly recommended if the switching frequency is above 2MHz (see External Bootstrap Diode section for detailed implementation information). With higher switching frequencies, the inductive reactance (XL) of capacitor comes to dominate, so that the ESL of input/output capacitor determines the input/output ripple voltage at higher switching frequency. As a result of that, high frequency ceramic capacitor is strongly recommended as input decoupling capacitor and output filtering capacitor for such high frequency operation. Layout becomes more important when the device switches at higher frequency. It is essential to place the input decoupling capacitor, catch diode and the MP4350 (Vin pin, SW pin and PGND) as close as possible, with traces that are very short and fairly wide. This can help to greatly reduce the voltage spike on SW node, and lower the EMI noise level as well. Try to run the feedback trace as far from the inductor and noisy power traces as possible. It is often a good idea to run the feedback trace on the side of the PCB opposite of the inductor with a ground plane separating the two. The compensation components should be placed closed to the MP4350. Do not place the compensation components close to or under high dv/dt SW node, or inside the high di/dt power loop. If you have to do so, the proper ground plane must be in place to isolate those. Switching loss is expected to be increased at high switching frequency. To help to improve the thermal conduction, a grid of thermal vias can be created right under the exposed pad. It is recommended that they be small (15mil barrel diameter) so that the hole is essentially filled up during the plating process, thus aiding conduction to the other side. Too large a hole can cause ‘solder wicking’ problems during the reflow soldering process. The pitch (distance between the centers) of several such thermal vias in an area is typically 40mil. Please refer to the layout example on EV4460 datasheet. External Bootstrap Diode It is recommended that an external bootstrap diode be added when the input voltage is no greater than 5V or the 5V rail is available in the system. This helps improve the efficiency of the regulator. The bootstrap diode can be a low cost one such as IN4148 or BAT54. MP4350 SW BS 5V Figure 3—External Bootstrap Diode This diode is also recommended for high duty cycle operation (when VOUT /VIN >65%) or low VIN (<5Vin) applications. At no load or light load, the converter may operate in pulse skipping mode in order to maintain the output voltage in regulation. Thus there is less time to refresh the BS voltage. In order to have enough gate voltage under such operating conditions, the difference of VIN –VOUT should be greater than 3V. For example, if the VOUT is set to 3.3V, the VIN needs to be higher than 3.3V+3V=6.3V to maintain enough BS voltage at no load or light load. To meet this requirement, EN pin can be used to program the input UVLO voltage to Vout+3V. |
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