APA600 datasheet(51/178 Pages) MICROSEMI

51 / 178 page

ProASICPLUS Flash Family FPGAs

v5.9

2-41

Table 2-26 • AC Specifications (3.3 V PCI Revision 2.2 Operation)

Symbol Parameter

Condition

Commercial/Industrial/Military/MIL-STD- 883

Units

Min.

Max.

IOH(AC)

Switching Current High

0 < VOUT ≤ 0.3VDDP

–12VDDP

0.3VDDP ≤ VOUT < 0.9VDDP

(–17.1 + (VDDP – VOUT))

0.7VDDP < VOUT < VDDP

See equation C – page 124 of

the PCI Specification

document rev. 2.2

(Test Point)

VOUT = 0.7VDDP

–32VDDP

IOL(AC)

Switching Current Low

VDDP > VOUT ≥ 0.6VDDP

16VDDP

0.6VDDP > VOUT > 0.1VDDP

(26.7VOUT)mA

0.18VDDP > VOUT > 0

See equation D – page 124 of

the PCI Specification

document rev. 2.2

(Test Point)

VOUT = 0.18VDDP

38VDDP

ICL

Low Clamp Current

–3 < VIN ≤ –1

–25 + (VIN + 1)/0.015

ICH

High Clamp Current

VDDP + 4 > VIN ≥ VDDP + 1

25 + (VIN – VDDP – 1)/0.015

slewR

Output Rise Slew Rate

0.2VDDP to 0.6VDDP load

V/ns

slewF

Output Fall Slew Rate

0.6VDDP to 0.2VDDP load

V/ns

Note: * Refer to the PCI Specification document rev. 2.2.

Output

Buffer

1/2 in. maxx

10 pF

Output

Buffer

10 pF

Pad Loading Applicable to the Rising Edge PCI

Pad Loading Applicable to the Falling Edge PCI

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