| Electronic Components Datasheet Search |
|
MP24943DN Datasheet(PDF) 2 Page - Monolithic Power Systems |
|
|
|||||||||||||||||||||||||||||
MP24943DN Datasheet(HTML) 2 Page - Monolithic Power Systems |
|
2 / 13 page ![]() MP24943 –3A, 55V, 100kHz STEP-DOWN CONVERTER MP24943 Rev. 0.83 www.MonolithicPower.com 2 12/11/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking Free Air Temperature (TA) MP24943DS* SOIC8 MP24943 -40°C to +85°C MP24943DN** SOIC8E MP24943 -40°C to +85°C * For Tape & Reel, add suffix –Z (eg. MP24943DS–Z); For RoHS, compliant packaging, add suffix –LF (eg. MP24943DS–LF–Z). * For Tape & Reel, add suffix –Z (eg. MP24943DN–Z); For RoHS, compliant packaging, add suffix –LF (eg. MP24943DN–LF–Z). PACKAGE REFERENCE VIN GND EN FB SW BST VO SS 1 2 3 4 8 7 6 5 TOP VIEW VIN GND EN FB SW BST VO SS 1 2 3 4 8 7 6 5 TOP VIEW EXPOSED PAD ON BACKSIDE CONNECT TO PIN 2 SOIC8 SOIC8E ABSOLUTE MAXIMUM RATINGS (1) Input Voltage VIN .......................................... 60V VSW..................................... -0.3V to (VIN + 0.3V) VBST ................................................... VSW + 6.5V All Other Pins...............................-0.3V to +6.5V Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature............... -65°C to +150°C Continuous Power Dissipation (TA = 25°C) (2) SOIC8 ...................................................... 1.38W SOIC8E...................................................... 2.5W Recommended Operating Conditions (3) Input Voltage VIN ..............................4.5V to 55V Output Voltage VOUT.........................0.8V to 45V Maximum Junction Temp. (TJ) ..................125°C Thermal Resistance (4) θJA θJC SOIC8..................................... 90 ...... 45... °C/W SOIC8E .................................. 50 ...... 10... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |