–3–

REV. 0

AD7862

AB

S

Parameter

Version

1

Version

Version

Units

Test Conditions/Comments

LOGIC OUTPUTS

4.0

4.0

4.0

V min

µA

0.4

0.4

0.4

V max

DB11–DB0

Floating-State Leakage Current

±10

±10

±10

µA max

Floating-State Capacitance

4

10

10

10

pF max

Output Coding

AD7862-10, AD7862-3

Twos Complement

AD7863-2

Straight (Natural) Binary

CONVERSION RATE

Conversion Time

3.6

3.6

3.6

µs max

For Both Channels

Track/Hold Acquisition Time

2, 3

0.3

0.3

0.3

µs max

POWER REQUIREMENTS

+5

+5

+5

V nom

±5% for Specified Performance

Normal Mode

15

15

15

mA max

Standby Mode

25

25

25

µA max

Power Dissipation

Normal Mode

75

75

75

mW max

Typically 60 mW

Standby Mode

125

125

125

µW max

Typically 75

µW

NOTES

°C to +85°C;

S Version: –55

°C to +125°C.

ABSOLUTE MAXIMUM RATINGS*

AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±0.3 V

Analog Input Voltage to AGND

AD7862-10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±17 V

AD7862-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±7V

AD7862-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V

Operating Temperature Range

Commercial (A, B Version) . . . . . . . . . . .

–40

°C to +85°C

Extended (S Version) . . . . . . . . . . . . . . . . –55

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . 670 mW

θ

. . . . . . . . . . . . . . . . . . . . 116

°C/W

Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260

°C

Ceramic DIP Package, Power Dissipation . . . . . . . . . 670 mW

θ

. . . . . . . . . . . . . . . . . . . . 116

°C/W

Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW

θ

. . . . . . . . . . . . . . . . . . . . 110

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW

θ

. . . . . . . . . . . . . . . . . . . . 110

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

*Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those listed in the

operational sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

ORDERING GUIDE

Input

Relative

Temperature

Package

Package

Model

Input

Accuracy

Range

Description

Option

AD7862AR-10

±10 V

±1 LSB

–40

°C to +85°C

28-Bit Small Outline Package

R-28

AD7862BR-10

±10 V

±1 LSB

–40

°C to +85°C

28-Bit Small Outline Package

R-28

AD7862ARS-10

±10 V

±1 LSB

–40

°C to +85°C

28-Bit Shrink Small Outline Package

RS-28

AD7862AN-10

±10 V

±1 LSB

–40

°C to +85°C

28-Bit Plastic DIP

N-28

AD7862SQ-10

±10 V

±1 LSB

–55

°C to +125°C

28-Bit Cerdip

Q-28

AD7862AR-3

±2.5 V

±1 LSB

–40

°C to +85°C

28-Bit Small Outline Package

R-28

AD7862BR-3

±2.5 V

±1 LSB

–40

°C to +85°C

28-Bit Small Outline Package

R-28

AD7862ARS-3

±2.5 V

±1 LSB

–40

°C to +85°C

28-Bit Shrink Small Outline Package

RS-28

AD7862AN-3

±2.5 V

±1 LSB

–40

°C to +85°C

28-Plastic DIP

N-28

AD7862AR-2

0 V to 2.5 V

±1 LSB

–40

°C to +85°C

28-Bit Small Outline Package

R-28

AD7862ARS-2

0 V to 2.5 V

±1 LSB

–40

°C to +85°C

28-Bit Shrink Small Outline Package

RS-28

°C to ensure compliance.

Specifications subject to change without notice.