MP38671 datasheet(2/11 Pages) MPS

2 / 11 page

MP38671 – 10A, 25V, 600KHz STEP-DOWN WITH SYNCHRONOUS GATE DRIVER

MP38671 Rev. 1.1

www.MonolithicPower.com

9/21/2011

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP38671DL

3x4 QFN14

3867

-40

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. MP38671DL–Z);

For RoHS Compliant Packaging, add suffix –LF (e.g. MP MP38671DL–LF–Z)

PACKAGE REFERENCE

TOP VIEW

EN/SYNC

N/C

GND

VCC

BST

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN...................................... 28V

VSW..................... -0.3V (-5V for < 10ns) to 29V

VBS.....................................................................

VSW + 6V

All Other Pins.................................–0.3V to +6V

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature.............. –65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN..........................4.5V to 25V

Output Voltage VOUT ......................0.8V to 15V

Maximum Junction Temp. (TJ) ................+125°C

Thermal Resistance

(4)

θJA

θJC

3x4 QFN14 .............................. 48....... 11.... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its operating

conditions.

4) Measured on JESD5 1-7, 4-layer PCB.. The exposed pad must

be thermally connected to a ground plane (or most negative

supply plane in split-supply applications).

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