MP62061DN datasheet(2/11 Pages) MPS

2 / 11 page

MP62061 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHE

MP62061 Rev. 0.91

www.MonolithicPower.com

9/23/2009

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Enable

Switch

Maximum

Continuous

Load Current

Maximum

Short-Circuit

Current

@ TA=25°C

Package

Top

Marking

Temperature

MP62061DH Active High Single

700mA

1250mA

MSOP8E 62061D

–40

°C to +85°C

MP62061DN Active High Single

700mA

1250mA

SOIC8E

62061D

–40

°C to +85°C

For Tape & Reel, add suffix –Z (eg. MP62061DH–Z); For RoHS Compliant Packaging, add suffix –LF ;

(eg. MP62061DH–LF–Z)

PACKAGE REFERENCE

TOP VIEW

GND

OUT

FLAG

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

GND

OUT

FLAG

TOP VIEW

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

MSOP8E

SOIC8E

ABSOLUTE MAXIMUM RATINGS

(1)

IN .................................................-0.3V to +6.0V

EN, FLAG, OUT to GND ..............-0.3V to +6.0V

Continuous Power Dissipation (TA = +25°C)

(2)

MSOP8E.................................................... 2.3W

SOIC8E...................................................... 2.5W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature...............–65°C to +150°C

Operating Temperature..............–40°C to +85°C

Thermal Resistance

(3)

θJA

θJC

MSOP8E................................. 55 ...... 12...

°C/W

SOIC8E .................................. 50 ...... 10...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) Measured on JESD51-7 4-layer PCB

MP62061DN Datasheet(PDF) 2 Page - Monolithic Power Systems

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