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MP62130 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP62130 Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 12 page ![]() MP62130/MP62131 –CURRENT-LIMITED POWER DISTRIBUTION SWITCH MP62130/MP62131 Rev. 0.9 www.MonolithicPower.com 2 6/15/2010 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2010 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Enable Switch Maximum Continuous Load Current Typical Short- Circuit Current @ TA=25℃ Package Top Marking Free Air Temperature (TA) MP62130ES SOIC8 MP62130 MP62130EK* Active Low MSOP8 62130 MP62131ES SOIC8 MP62131 MP62131EK* Active High Single 500mA 650mA MSOP8 62131 -20 °C to +85°C * For Tape & Reel, add suffix –Z (e.g. MP62130/MP62131EK–Z). For RoHS Compliant packaging, add suffix –LF (e.g. MP62130/MP62131EK–LF–Z); PACKAGE REFERENCE 1 2 3 4 8 7 6 5 TOP VIEW EN* FLAG GND NC OUT IN OUT NC MSOP8 EN* FLAG GND NC OUT IN OUT NC 1 2 3 4 8 7 6 5 TOP VIEW SOIC8 * EN is active high for MP6231 ABSOLUTE MAXIMUM RATINGS (1) IN .................................................-0.3V to +6.5V EN, FLAG, OUT to GND ..............-0.3V to +6.5V Continuous Power Dissipation (TA = +25°C) (2) MSOP8 .................................................... 0.83W SOIC8..................................................... 1.4W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature............... -65°C to +150°C Operating Junct. Temp (TJ)...... -20°C to +125°C Thermal Resistance (3) θJA θJC MSOP8 .................................. 150 ..... 65... °C/W SOIC8..................................... 90 ...... 42... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) Measured on JESD51-7 4-layer PCB. |
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