MPQ4462DN datasheet(2/20 Pages) MPS

2 / 20 page

MPQ4462 – 3.5A, 4MHz, 36V, STEP-DOWN CONVERTER, AEC-Q100 QUALIFIED

MPQ4462 Rev. 1.11

www.MonolithicPower.com

7/17/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

MPQ4462DQ*

QFN10 (3mm×3mm)

MPQ4462DN**

SOIC8E

MP4462DN

MPQ4462DQ-AEC1*

QFN10 (3mm×3mm)

MPQ4462DN-AEC1**

SOIC8E

MP4462DN

*For Tape & Reel, add suffix –Z (e.g. MPQ4462DQ–AEC1-Z);

For RoHS, compliant packaging, add suffix –LF (e.g. MPQ4462DQ–AEC1-LF–Z).

**For Tape & Reel, add suffix –Z (e.g. MPQ4462DN–AEC1-Z);

For RoHS, compliant packaging, add suffix –LF (e.g. MPQ4462DN–AEC1-LF–Z).

PACKAGE REFERENCE

COMP

BST

VIN

FREQ

GND

TOP VIEW

QFN10

SOIC8E

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage (VIN).....................–0.3V to +40V

Switch Voltage (VSW)............ –0.3V to VIN + 0.3V

BST to SW .....................................–0.3V to +6V

All Other Pins.................................–0.3V to +6V

Continuous Power Dissipation (TA = +25°C)

(2)

QFN10 (3mmx3mm) .................................. 2.5W

SOIC8E...................................................... 2.5W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature.............. –65°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................3.8V to 36V

Output Voltage VOUT.........................0.8V to 30V

Operating Junct. Temp. .......... –40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

QFN10 (3mm×3mm)............... 50 ...... 12... °C/W

SOIC8E .................................. 50 ...... 10... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

TOP VIEW

COMP

BST

VIN

FREQ

GND

EXPOSED PAD

ON BACKSIDE

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