W29GL032C datasheet(4/68 Pages) WINBOND

4 / 68 page

W29GL032C

7.6

Common Flash Memory Interface (CFI) Mode ............................................................. 25

7.6.1

Query Instruction and Common Flash memory Interface (CFI) Mode.............................25

ELECTRICAL CHARACTERISTICS ......................................................................................... 29

8.1

Absolute Maximum Stress Ratings............................................................................... 29

8.2

Operating Temperature and Voltage ............................................................................ 29

8.3

DC Characteristics ........................................................................................................ 30

8.4

Switching Test Circuits.................................................................................................. 31

8.4.1

Switching Test Waveform ...............................................................................................31

8.5

AC Characteristics ........................................................................................................ 32

8.5.1

Instruction Write Operation .............................................................................................33

8.5.2

Read / Reset Operation ..................................................................................................34

8.5.3

Erase/Program Operation ...............................................................................................36

8.5.4

Write Operation Status....................................................................................................46

8.5.5

WORD/BYTE CONFIGURATION (#BYTE).....................................................................50

8.5.6

DEEP POWER DOWN MODE........................................................................................52

8.5.7

WRITE BUFFER PROGRAM..........................................................................................52

8.6

Recommended Operating Conditions........................................................................... 53

8.6.1

At Device Power-up ........................................................................................................53

8.7

Erase and Programming Performance ......................................................................... 54

8.8

Data Retention .............................................................................................................. 54

8.9

Latch-up Characteristics ............................................................................................... 54

8.10

Pin Capacitance............................................................................................................ 54

PACKAGE DIMENSIONS ......................................................................................................... 55

9.1

TSOP 48-pin 12x20mm ................................................................................................ 55

9.2

TSOP 56-pin 14x20mm ................................................................................................ 56

9.3

Low-Profile Fine-Pitch Ball Grid Array, 64-ball 11x13mm (LFBGA64) ......................... 57

9.4

Thin & Fine-Pitch Ball Grid Array, 6x8 mm

2, pitch: 0.8 mm,

∅=0.4mm (TFBGA48) .... 58

ORDERING INFORMATION..................................................................................................... 59

10.1

Ordering Part Number Definitions................................................................................. 59

10.2

Valid Part Numbers and Top Side Marking .................................................................. 60

HISTORY .................................................................................................................................. 61

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