PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Addendum-Page 7

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

SNJ54LS244FK

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

SNJ54LS

244FK

SNJ54LS244J

ACTIVE

CDIP

J

20

1

TBD

A42

N / A for Pkg Type

-55 to 125

7705701RA

SNJ54LS244J

SNJ54LS244W

ACTIVE

CFP

W

20

1

TBD

Call TI

N / A for Pkg Type

-55 to 125

7705701SA

SNJ54LS244W

SNJ54S240FK

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

SNJ54S

240FK

SNJ54S240J

ACTIVE

CDIP

J

20

1

TBD

A42

N / A for Pkg Type

-55 to 125

SNJ54S240J

SNJ54S240W

ACTIVE

CFP

W

20

1

TBD

Call TI

N / A for Pkg Type

-55 to 125

SNJ54S240W

SNJ54S241FK

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

SNJ54S

241FK

SNJ54S241J

ACTIVE

CDIP

J

20

1

TBD

A42

N / A for Pkg Type

-55 to 125

SNJ54S241J

SNJ54S241W

ACTIVE

CFP

W

20

1

TBD

Call TI

N / A for Pkg Type

-55 to 125

SNJ54S241W

SNJ54S244FK

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

SNJ54S

244FK

SNJ54S244J

ACTIVE

CDIP

J

20

1

TBD

A42

N / A for Pkg Type

-55 to 125

SNJ54S244J

SNJ54S244W

ACTIVE

CFP

W

20

1

TBD

Call TI

N / A for Pkg Type

-55 to 125

SNJ54S244W

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.