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ASM5206C Datasheet(PDF) 6 Page - Aplus Intergrated Circuits |
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ASM5206C Datasheet(HTML) 6 Page - Aplus Intergrated Circuits |
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6 / 7 page ![]() Rev 1.0 5 1.4 Bonding Diagram Substrate must be connected to GND. ASM5206C/6306C Pad Location CHIP SIZE: X= 1550+80(um) , Y= 2700+80(um) PAD # PAD Name X Y PAD # PAD Name X Y 1 RA3 -664.92 -944.32 7 TEST_PAD 105.44 -1269 2 RA2 -664.92 -1072.44 8 COUT 303.96 -1269 3 RA1 -662.64 -1269 9 VDD 683.04 -1269 4 RA0 -468.24 -1269 10 RB0 664.92 -1068 5 OSC -281.04 -1269 11 RB1 664.92 -949.6 6 GND -111.72 -1269 ASM5206C/6306C CHIP SIZE: X= 1550+80(um) , Y= 2700+80(um) 192K x 10 bit ROM 6 7 8 9 5 4 1 2 3 10 11 ASM5206C/6306C ASM5206C/6306C |
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