Material Composition Specification

HD DIP Case

Device average mass. . . . . . . . . . . . . . . . . . . . . . . . . . . . 126.8 mg

Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%

www.centra lsemi.com

R3 (3-June 2011)

Component

Material

Material

Substance CAS No.

Substance

(%wt)

(mg)

(%wt)

(mg)

(ppm)

active device

doped Si

3.38%

4.28

Si

7440-21-3

3.38%

4.28

33,754

leadframe

Cu alloy

33.5%

42.49

Cu

7440-50-8

33.44%

42.405

334,424

Fe

7439-89-6

0.05%

0.064

505

P

7723-14-0

0.01%

0.018

142

die attach

high temperature

solder paste

7.16%

9.08

Pb

7439-92-1

6.624%

8.399

66,238

Sn

7440-31-5

0.358%

0.454

3,580

Ag

7440-22-4

0.179%

0.227

1,790

encapsulation*

EMC

55.48%

70.34

SiO2

14808-60-7

37.72%

47.834

377,240

epoxy resin

29690-82-2

10.54%

13.365

105,402

phenol resin

9003-35-4

5.55%

7.034

55,473

Sb2O3

1309-64-4

0.55%

0.703

5,544

Br

7726-95-6

1.11%

1.407

11,096

EMC GREEN

55.48%

70.34

silica (fused) 60676-86-0

42.72%

54.165

427,169

epoxy resin

29690-82-2

5.55%

7.034

55,473

phenol resin

9003-35-4

5.38%

6.823

53,809

carbon black

1333-86-4

0.17%

0.211

1,664

metal

hydroxide

1309-42-8

1.66%

2.11

16,640

plating**

tin/lead process

0.48%

0.61

Sn

7440-31-5

0.38%

0.488

3,849

Pb

7439-92-1

0.10%

0.122

962

matte tin

0.48%

0.61

Sn

7440-31-5

0.48%

0.61

4,811

*EMC GREEN molding compound is Halogen-Free.

**For Lead Free plating, add suffix “LEAD FREE” to part number.

For Tin/Lead plating, add suffix “TIN/LEAD” to part number.

No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability.

Disclaimer

The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no

guarantee to completeness or accuracy, as some information is derived from data sources outside the company.