8XC52/54/58

EPROM PROGRAMMING AND VERIFICATION WAVEFORMS

272336–23

*5 pulses for the EPROM array. 25 pulses for the encryption table and lock bits.

Thermal Impedance

All thermal impedance data is approximate for static

air conditions at 1W of power dissipation. Values will

change depending on operating conditions and ap-

plications. See the Intel Packaging Handbook (Order

Number 240800) for a description of Intel’s thermal

impedance test methodology.

DATA SHEET REVISION HISTORY

Data sheets are changed as new device information

becomes available. Verify with your local Intel sales

office that you have the latest version before finaliz-

ing a design or ordering devices.

The following differences exist between datasheet

(272336-003) and the previous version

(272336-002).

1. Removed 8XC5X-3 and 8XC5X-20 from the data

sheet.

2. Included 8XC5X-24 and 8XC5X-33 devices.

3. Removed the statement ‘‘The 80C32 standard, -1

and -2, and 80C52 standard, -1 and -2, do not

have the . . . ’’ from the section DESIGN CONSID-

ERATION.

The following differences exist between this data-

sheet (272336-002) and the previous version

(272336-001).

1. Removed 8XC5X-L from the data sheet.

2. Included features not available in 80C32-Stan-

dard, -1 and -2, and 80C52-Standard, -1 and -2

devices.

This 8XC5X datasheet (272336-001) replaces the

following datasheets:

87C52/80C52/80C32

270757-003

87C52/80C52/80C32 EXPRESS

270868-002

87C52-20/80C52-20/80C32-20

272272-001

87C54/80C54

270816-004

87C54/80C54 EXPRESS

270901-001

87C54-20/-3 80C54-20/-3

270941-003

87C54/80C58

270900-003

87C58/80C58 EXPRESS

270902-001

87C58-20/-3 80C58-20/-3

272029-002

23

The following differences exist between this data-

sheet (272336-005) and the previous version

(272336-004/-003).

1. Removed references to package prefixes. When

possible, prefix variables replaced with

x.