6

Revised: December 9, 2011 01:32 PM

©2011 Littelfuse, Inc

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

Standard Bidirectional SIDACs

Kxxxzy Series

Soldering Parameters

Reflow Condition

Pb – Free assembly

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

60 – 180 secs

Average ramp up rate (LiquidusTemp)

(T

5°C/second max

T

5°C/second max

Reflow

-Temperature (T

217°C

-Temperature (t

60 – 150 seconds

PeakTemperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

5°C/second max

Time 25°C to peakTemperature (T

8 minutes Max.

Do not exceed

280°C

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Physical Specifications

Reliability/Environmental Tests

Test

Specifications and Conditions

High Temperature

Voltage Blocking

MIL-STD-750: Method 1040, Condition

A Rated V

hours

Temperature Cycling

MIL-STD-750: Method 1051

-40°C to 150°C, 15-minute dwell, 100

cycles

Biased Temperature &

Humidity

EIA/JEDEC: JESD22-A101

80% min V

hours

High Temp Storage

MIL-STD-750: Method 1031

150°C, 1008 hours

Low-Temp Storage

-40°C, 1008 hours

Thermal Shock

MIL-STD-750: Method 1056

0°C to 100°C, 5-minute dwell,

10-second transfer, 10 cycles

Autoclave

(Pressure Cooker Test)

EIA/JEDEC: JESD22-A102

121°C, 100%RH, 2atm, 168 hours

Resistance to

Solder Heat

MIL-STD-750: Method 2031

260°C, 10 seconds

Solderability

ANSI/J-STD-002: Category 3

Lead Bend

MIL-STD-750: Method 2036, Condition E

Terminal Finish

100% Matte Tin Plated / Pb-free Solder

Dipped

Body Material

UL recognized epoxy meeting flammability

classification 94V-0

Lead Material

Copper Alloy

Design Considerations

Careful selection of the correct device for the application’s

operating parameters and environment will go a long

way toward extending the operating life of the Thyristor.

Overheating and surge currents are the main killers of

SIDACs. Correct mounting, soldering, and forming of the

leads also help protect against component damage.