TPS736xx

SBVS038T – SEPTEMBER 2003 – REVISED AUGUST 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

(2)

TPS736xx yy yz

YYY is package designator.

Z is package quantity.

(1)

For the most current specification and package information, refer to the Package Option Addendum located at the end of this datasheet

or see the TI website at www.ti.com.

(2)

Most output voltages of 1.25V and 1.3V to 5.0V in 100mV increments are available on a quick-turn basis using innovative factory

EEPROM programming. Minimum order quantities apply; contact factory for details and availability.

(3)

For fixed 1.20V operation, tie FB to OUT.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

(1)

PARAMETER

TPS736xx

UNIT

–0.3 to 6.0

V

–0.3 to 6.0

V

–0.3 to 5.5

V

–0.3 to 6.0

V

Peak output current

Internally limited

Output short-circuit duration

Indefinite

Continuous total power dissipation

See Thermal Information Table

–55 to +150

°C

Storage temperature range

–65 to +150

°C

ESD rating, HBM

2

kV

ESD rating, CDM

500

V

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics

is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

2

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