64GA106 datasheet(270/330 Pages) MICROCHIP

270 / 330 page

PIC24FJ256GA110 FAMILY

DS39905E-page 270

 2010 Microchip Technology Inc.

28.1

DC Characteristics

FIGURE 28-1:

PIC24FJ256GA110 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

TABLE 28-1:

THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

PIC24FJ256GA110 Family:

Operating Junction Temperature Range

-40

—

+140

°C

Operating Ambient Temperature Range

-40

—

+125

°C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD x (IDD –

 IOH)

PINT + PI/O

I/O Pin Power Dissipation:

PI/O =

 ({VDD – VOH} x IOH) +  (VOL x IOL)

Maximum Allowed Power Dissipation

PDMAX

(TJ – TA)/

JA

Frequency

3.00V

2.00V

32 MHz

2.75V

2.50V

2.25V

2.75V

16 MHz

2.25V

For frequencies between 16 MHz and 32 MHz, FMAX = (64 MHz/V) * (VDDCORE – 2V) + 16 MHz.

Note 1:

When the voltage regulator is disabled, VDD and VDDCORE must be maintained so that

VDDCORE

VDD3.6V.

PIC24FJXXXGA1XX

TABLE 28-2:

THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Notes

Package Thermal Resistance, 14x14x1 mm TQFP

JA

50.0

—

°C/W

(Note 1)

Package Thermal Resistance, 12x12x1 mm TQFP

JA

69.4

—

°C/W

(Note 1)

Package Thermal Resistance, 10x10x1 mm TQFP

JA

76.6

—

°C/W

(Note 1)

Package Thermal Resistance, 9x9x0.9 mm QFN

JA

28.0

—

°C/W

(Note 1)

Note 1:

Junction to ambient thermal resistance, Theta-JA (

JA) numbers are achieved by package simulations.

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