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AS1100

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Electrical Parameters

VDD to GND

-0.3

7

V

All other pins to GND

-0.3

(max 7V)

V

Current

DIG 0:DIG 7 Sink Current

500

mA

SEG A : SEG G, SEG DP

100

mA

Latch-Up Immunity

±200

mA

Norm: JEDEC 78

Electrostatic Discharge

Digital outputs

500

V

Norm: MIL 883 E method 3015

All other pins

1000

V

Continuous Power Dissipation (TA = +85°C)

Wide SOIC

941

mW

Derate 11.8mW/ºC

above +70ºC

Temperature Ranges and Storage Conditions

Storage Temperature Range

-55

+150

ºC

Package Body Temperature (Wide SOIC)

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Humidity

5

85

%

Non-condensing

Moisture Sensitive Level

3

Represents a max. floor life time of 168h