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AS1116

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied.

Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Electrical Parameters

Input Voltage Range

-0.3

7

V

All other pins to GND

-0.3

7 or

V

Current

DIG0:DIG7 Sink Current

500

mA

SEGA:SEGG, SEGDP

100

mA

Input Current (latch-up immunity)

±100

mA

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge

Digital outputs

1000

V

Norm: MIL 833 E method 3015

All other pins

1000

V

Thermal Information

Thermal Resistance

88

ºC/W

on PCB, QSOP-24 package

30.5

ºC/W

on PCB, TQFN(4x4)-24 package

Temperature Ranges and Storage Conditions

Junction Temperature

+150

°C

Storage Temperature

-55

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020 “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages

is matte tin (100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitive Level

QSOP-24 package

1

%

Represents a max. floor life time of unlimited

TQFN(4x4)-24 package

3

%

Represents a max. floor life time 168h