DAP

Connect to GND

IN

EN

N/C

SS

5

6

7

8

OUT

ADJ

GND

BIAS

1

2

3

4

TAB

IS

GND

BIAS

OUT

GND

SS

1

2

3

4

5

IN

6

7

ADJ

EN

TAB

IS

GND

BIAS

OUT

GND

SS

1

2

3

4

5

IN

6

7

ADJ

EN

LP38852

SNVS482E – JANUARY 2007 – REVISED APRIL 2013

www.ti.com

Connection Diagrams

Top View

Top View

Figure 1. DDPAK-7 Package

Figure 2. TO-220-7 Package

See Package Number KTW0007B

See Package Number NDZ0007B

Top View

Figure 3. SO PowerPAD-8 Package

See Package Number DDA0008A

Pin Descriptions

TO-220-7 and DDPAK-7 Packages

TO-220–7

DDPAK–7

SO PowerPAD-8

Pin

Pin Description

Pin #

Pin #

Pin #

Symbol

1

1

5

SS

turn-on.

2

2

6

EN

Device Enable, High = On, Low = Off.

3

3

7

IN

The unregulated voltage input

4

4

4

GND

Ground

5

5

1

ADJ

The feedback connection to set the output voltage

6

6

2

OUT

The regulated output voltage

7

7

3

BIAS

The supply for the internal control and reference circuitry.

-

-

8

N/C

No internal connection

The TAB is a thermal and electrical connection that is physically

TAB

TAB

-

TAB

attached to the backside of the die, and used as a thermal heat-sink

connection. See the Application Informationsection for details.

The DAP is a thermal connection only that is physically attached to

-

-

DAP

DAP

the backside of the die, and used as a thermal heat-sink connection.

See the Application Information section for details.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

2

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