RT2010 datasheet(8/10 Pages) YAGEO

8 / 10 page

Chip Resistor Surface Mount

www.yageo.com

Oct 21, 2009 V.4

Product specification

SERIES

0402 to 2512 (RoHS Compliant)

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

Short Time Overload

IEC60115-1 4.13

2.5 times of rated voltage or maximum

overload voltage whichever is less for 5 sec at

room temperature

±(0.5%+0.05 Ω)

No visible damage

Board Flex/

Bending

IEC 60068-2-21

Chips mounted on a 90mm glass epoxy resin

PCB (FR4)

Bending: see table 6 for each size

Bending time: 60±5 seconds

±(0.25%+0.05 Ω)

No visible damage

Low Temperature

Operation

IEC 60068-2-1

The resistor shall be subjected to a DC rated

voltage for 1.5 h-on, 0.5 h-off, at -55±3 °C

This constitutes shall be repeated for 96 hours

However the applied voltage shall not exceed

the maximum operating voltage

±(0.5%+0.05 Ω)

No visible damage

Insulation Resistance

IEC 60115-1 4.6

Rated continuous overload voltage (RCOV)

for 1 minute

Details see below table 5

≥10 GΩ

Dielectric Withstand

Voltage

IEC 60115-1 4.7

Maximum voltage (Vrms) applied for 1 minute

Details see below table 5

No breakdown or flashover

Solderability

- Wetting

IPC/JEDEC J-STD-002B test B

Electrical Test not required

Magnification 50X

SMD conditions:

1st step: method B, aging 4 hours at 155°C

dry heat

2nd step: leadfree solder bath at 245±3°C

Dipping time: 3±0.5 seconds

Well tinned (≥95%

covered)

No visible damage

- Leaching

IPC/JEDEC J-STD-002B test D

Leadfree solder, 260 °C, 30 seconds

immersion time

No visible damage

- Resistance to

Soldering Heat

IEC 60068-2-58

Condition B, no pre-heat of samples.

Leadfree solder, 260 °C, 10 seconds

immersion time

Procedure 2 for SMD: devices fluxed and

cleaned with isopropanol

±(0.5%+0.05 Ω)

No visible damage

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