OPA347, 2347, 4347

12

SBOS167D

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SOLDER PAD

SOLDER MASK

COPPER

DEFINITION

COPPER PAD

OPENING

THICKNESS

STENCIL OPENING

STENCIL THICKNESS

Non-Solder Mask

275

µm

375

µm

1 oz max

275

µm X 275µm, sq

125

µm Thick

Defined (NSMD)

(+0.0, –25

µm)

(+0.0, –25

µm)

NOTES: (1) Circuit traces from NSMD-defined PWB lands should be less tham 100

µm (preferrably = 75µm) wide in the exposed area inside the solder mask

opening. Wider trace widths will reduce device stand off and impact reliability. (2) Recommended solder paste is type 3 or type 4. (3) Best reliability results are

achieved when the PWB laminate glass transistion temperature is above the operating range of the intended application. (4) For PWB using an Ni/Au surface

finish, the gold thickness should be less than 0.5um to avoid solder embrittlement and a reduction in thermal fatigue performance. (5) Solder mask thickness

should be less than 20um on top of the copper circuit pattern. (6) Best solder stencil performance will be achieved using laser-cut stencils with electro polishing.

Use of chemically etched stencils results in inferior solder paste volume control. (7) Trace routing away from the WLCSP device should be balanced in X and

Y directions to avoid unintentional component movement due to solder wetting forces.

TABLE II. Recommended Land Pattern.

FIGURE 12. Recommended Land Area.

LAND PATTERNS AND ASSEMBLY

The recommended land pattern for the OPA2347YED pack-

age is detailed in Figure 12 with specifications listed in Table

II. The maximum amount of force during assembly should be

limited to 30 grams of force per bump.