694-3-R100KD datasheet(2/3 Pages) ETC

2 / 3 page

694, 698,

694, 698, 699

699

BI Technologies Corporation

4200 Bonita Place

Fullerton, CA 92835 USA

Website: www.bitechnologies.com

May 29, 2008

page 2 of 3

BI technologies

PACKAGE POWER AND DE

PACKAGE POWER AND DERATING CURVE

RATING CURVE

Model

Package Power @ 70°°°°C(watts)

694

0.4

698

0.6

699

0.6

ENVIRONMENTAL (MIL

ENVIRONMENTAL (MIL----R

R----83401)

83401)

Thermal Shock plus Power Conditioning

∆R 0.25%

Short Time Overload

∆R 0.1%

Terminal Strength

∆R 0.1%

Moisture Resistance

∆R 0.2%

Mechanical Shock

∆R 0.25%

Vibration

∆R 0.25%

Low Temperature Operation

∆R 0.1%

High Temperature Exposure

∆R 0.1%

Load Life, 1,000 Hours

∆R 0.1%

Resistance to Solder Heat

∆R 0.1%

Dielectric Withstanding Voltage

200V for 1 minute

Marking Permanency

MIL-STD-202, Method 215

Lead Solderability

MIL-STD-202, Method 208

Flammability

UL-94V-0 Rated

Storage Temperature Range

-65°C to +125°C

MECHANICAL

Lead Plating

80/20 Tin Lead (Standard)

100 matte Tin (RoHS)

Lead Material

Copper Alloy

Lead Configuration

Thru hole

Substrate Material

Alumina

Resistor Material

Passivated Nichrome

Body Material

Molded Epoxy

Maximum power per resistor @ 70°C is 100 mW, not to exceed package power

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