REF102

®

3

TEMPERATURE

MAX INITIAL

MAX DRIFT

PRODUCT

PACKAGE

RANGE

ERROR (mV)

(ppm/

REF102AU

8-Pin SOIC

–25

°C to +85°C

±10

±10

REF102AP

8-Pin Plastic DIP

–25

°C to +85°C

±10

±10

REF102BP

8-Pin Plastic DIP

–25

°C to +85°C

±5

±5

REF102AM

Metal TO-99

–25

°C to +85°C

±10

±10

REF102BM

Metal TO-99

–25

°C to +85°C

±5

±5

REF102CM

Metal TO-99

–25

°C to +85°C

±2.5

±2.5

REF102RM

Metal TO-99

–55

°C to +125°C

±10

±10

REF102SM

Metal TO-99

–55

°C to +125°C

±5

±5

ORDERING INFORMATION

PIN CONFIGURATIONS

Top View

DIP/SOIC

8

7

1

4

5

3

26

Common

Trim

V

OUT

NC

NC

NC

Noise Reduction

8

7

6

5

1

2

3

4

Noise Reduction

NC

V

OUT

Trim

NC

V+

Com

NC

V+

Top View

TO-99

Input Voltage ...................................................................................... +40V

Operating Temperature

P,U .................................................................................. –25

°C to +85°C

M ................................................................................... –55

°C to +125°C

Storage Temperature Range

P,U .................................................................................. –40

°C to +85°C

M ................................................................................... –65

°C to +150°C

Lead Temperature (soldering, 10s) ................................................ +300

°C

(SOIC, 3s) ....................................................... +260

°C

Short-Circuit Protection to Common or V+ ............................... Continuous

ABSOLUTE MAXIMUM RATINGS

PACKAGE INFORMATION

PACKAGE DRAWING

PRODUCT

PACKAGE

REF102AU

8-Pin SOIC

182

REF102AP

8-Pin Plastic DIP

006

REF102BP

8-Pin Plastic DIP

006

REF102AM

Metal-TO-99

001

REF102BM

Metal-TO-99

001

REF102CM

Metal-TO-99

001

REF102RM

Metal-TO-99

001

REF102SM

Metal-TO-99

001

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.