®

REF200

2

SPECIFICATIONS

REF200AP, AU

PARAMETER

CONDITION

MIN

TYP

MAX

UNITS

CURRENT SOURCES

Current Accuracy

±0.25

±1%

Current Match

±0.25

±1%

Temperature Drift

Specified Temp Range

25

ppm/

°C

Output Impedance

2.5V to 40V

20

100

M

Ω

3.5V to 30V

200

500

M

Ω

Noise

BW = 0.1Hz to 10Hz

1

nAp-p

f = 10kHz

20

pA/

√Hz

Voltage Compliance (1%)

See Curves

Capacitance

10

pF

CURRENT MIRROR

I = 100

µA Unless

Otherwise Noted

Gain

0.995

1

1.005

Temperature Drift

25

ppm/

°C

Impedance (output)

2V to 40V

40

100

M

Ω

Nonlinearity

I = 0

µA to 250µA

0.05

%

Input Voltage

1.4

V

Output Compliance Voltage

See Curves

Frequency Response (–3dB)

Transfer

5

MHz

TEMPERATURE RANGE

Specification

–25

+85

°C

Operating

–40

+85

°C

Storage

–40

+125

°C

ELECTRICAL

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes

no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change

without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant

any BURR-BROWN product for use in life support devices and/or systems.

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

Applied Voltage ..................................................................... –6V to +40V

Reverse Current ........................................................................... –350

µA

Voltage Between Any Two Sections .................................................

±80V

Operating Temperature ................................................... –40

°C to +85°C

Storage Temperature ..................................................... –40

°C to +125°C

Lead Temperature (soldering, 10s) .............................................. +300

°C

(SOIC 3s) ........................................................ +260

°C

I

I

Substrate

Mirror Input

Low

Low

Mirror Common

Mirror Output

1

2

3

4

8

7

6

5

1

2

High

High

1

2

I

I

Top View

DIP/SOIC

PACKAGE

DRAWING

TEMPERATURE

PRODUCT

PACKAGE

RANGE

REF200AP

8-Pin Plastic DIP

006

–25

°C to +85°C

REF200AU

8-Pin SOIC

182

–25

°C to +85°C

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book. (2) Grade designation “A”

may not be marked. Absence of grade designation indicates A grade.

PACKAGE/ORDERING INFORMATION

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.