LM3940

SNVS114E – MAY 1999 – REVISED MARCH 2013

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Figure 4. 16-Lead CDIP

Figure 5. 16-Lead CLGA

(Top View)

(Top View)

Drawing Number NFE0016A

Drawing Number NAC0016A

A.

Pin 2 and pin 7 are fused to center DAP.

B.

Pin 5 and 6 need to be tied together on PCB board.

Figure 6. 8-Lead WSON

Drawing Number NGN008A

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1)

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 5 seconds)

260°C

Internally Limited

Input Supply Voltage

7.5V

2 kV

(1)

Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply

when operating the device outside of its rated operating conditions.

(2)

resistance,

temperature, and the regulator will go into thermal shutdown. The value of

TO-220 package, 80°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. The effective value of

reduced by using a heatsink (see APPLICATION HINTS for specific information on heatsinking). The value of

package is specifically dependant on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal

resistance and power dissipation for the WSON package, refer to Application Note AN-1187 SNOA401. The

with a JESD51-7 test board having 6 thermal vias under the exposed pad.

(3)

ESD rating is based on the human body model: 100 pF discharged through 1.5 k

Ω.

Operating Ratings

(1)

−40°C to +125°C

(1)

Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply

when operating the device outside of its rated operating conditions.

2

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