HB01U 11/98 REV B

Page 3

MECHANICAL

Package/Pinout "Y" and "Z"

0.100±0.010"

(2.54±0.25)

0.020±0.002"

(0.51±0.05)

0.015±0.005"

(0.38±0.13)

0.375±0.005"

(9.52±0.13)

1.285±0.010"

(32.64±0.25)

24 23 22

15 14 13

12

11

10

3

2

1

0.014±0.002"

(0.36±0.05)

.015±.010"

(.38±.25)

0.525±0.010"

(13.34±0.25)

0.695±0.015"

(17.65±0.38)

0°-

15°

0.125+0.030"

-0.000"

(3.18+0.76)

(

-0.00)

0.600"

(15.24)

0.100±0.010"

(2.54±0.25)

0.020±0.002"

(0.51±0.05)

0.015±0.005"

(0.38±0.13)

0.375±0.005"

(9.52±0.13)

1.285±0.010"

(32.64±0.25)

24 23 22

15 14 13

12

11

10

3

2

1

0.525±0.010"

(13.34±0.25)

SIDE VIEWS

TOP VIEWS

END VIEWS

SMD PACKAGE

DIP PACKAGE

HB01UxxyzzY

HB01UxxyzzZ

NU = Do Not Use.

NC = No Internal Connection.

Duplicate pin functions are internally connected.

All dimensions are in inches (millimeters).

GRID: 0.100 inches (2.54 millimeters)

Typically Marked with: specific model ordered, date code, job code and Logo.

PIN CONNECTIONS

PIN#

SINGLES

DUALS

Common

3NU

10

11

NC

NC

12

13

14

NC

NC

15

21

NC

NC

22

NU

23

Common

24

RECOMMENDED LAND PATTERN

24 23 22

15 14 13

12

11

10

3

2

1

0.730"

(18.54)

1.150"

(29.21)

0.100"

(2.54)

0.080"

(2.03)

0.040"

(1.02)

50

100

150

200

250

TIME (seconds)

235 °C MAX

220

190

30 sec MAX

(>220°C)

90 sec MAX

(>190°C)

RECOMMENDED REFLOW PROFILE

MATERIAL: Units are encapsulated in a low thermal resistance molding

compound which has excellent chemical resistance, wide operating

temperature range, and good electrical properties under high humidity

environments. The encapsulant and outer shell of the unit have UL94V-0

ratings. Lead material is brass with a solder plated surface to allow ease of

solderability.